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制程能力

技术指标
制作能力
层数Layers
2-10层
基板厚度Material Thickness
0.3-3.2
板材类型Material Type
FR-4,Halogen free,High TG
板材供应商Material Supplier
KB,Nanya,Shengyi,Doosan
铜箔厚度Copper Thickness
0.5-5OZ
阻燃特性Flammability Rating
94V-0
抗剥离强度Peel Strength
12.3n/cm
翘曲度Warp And Twist
≤0.75%
绝缘电阻Insulation Resistor
≥5MΩ
测试电压Test Voltage
100-300V
成品板面积 Finished Board Size
560X600mm
最小线宽线距Min Line Width/Space
0.076/0.076mm
孔壁铜厚 Hole Wall Copper Thickness
≥15um
外层最小焊环Outer Minimum Annual Ring
≥0.125mm
最小孔径Min Hole.
0.2mm
PTH/NPTH孔径公差 Hole Diam Tolerance
0.076/0.05mm(PTH/NPTH)
机锣外形公差Routing Outling Tolerance
±0.10mm
冲板外形公差Punching Outling Tolerance
±0.10mm
绿油桥能力Solder Mask Bridge
≥4Mil
阻焊硬度Solder/Mask Hardness
6H
油墨供应商S/M Ink Supplier
Nanya,Taiyo,Tamura,Coates
阻焊耐焊性S/M Solderability
245℃ 10Sec
热冲击能力Hot Immersion Ability
288℃ 10Sec
表面镀层Surface Plating
喷锡,无铅喷锡,钴金,厚金,沉金,抗氧化
HAL,HAL LF,Immersion-Sn,Immersion-Ag,Immersion-Au,OSP.
质量标准Quality Standard
IPC-A-600G,IPC-TM-650,IPC-6012B
阻焊类型Solder Mask Type
液态感兴阻焊LPI,哑光
文字Legend
热固 Heat-Cure Ink